Labels for the identification of circuit boards
The labels for circuit boards withstand extreme temperatures during the soldering and ensure the tracing during the manufacturing. They will be additionally exposed to the heat sources like hot air, infrared and steam. The labels for circuit boards are extremely robust and resistant to cleaning procedures with hot and aggressive chemicals and to high-pressure/ultrasonic technique when the residues of soldering flux will be removed. If required they can be subsequently inscribed by the customer with individual data on site. The labels will be adjusted to the customer-specific requirements and applications and often serve for the identification, management, control and tracing of materials and products by encoding.
The main features of the circuit board labeling
- High resistance at extreme temperature peaks
- High resistance in contact with aggressive cleaning chemicals
- Electrostatically dissipative adhesive
- High dimensional stability and reliable legibility
- Individual die-cut forms possible – adjusted to the structure of the circuit board
- Colored label foils offer additional identification possibilities
- High abrasion resistance with suitable thermal transfer ribbons for the thermal transfer printing
- Suitable for standard-compliant labeling lie e.g. UL/CSA etc.
- Very high adhesive power of the labels also on difficult substrates like e.g. rough surfaces
- Optimization of the processes by automation of material- and product flow
- Additional safety functions like security cutouts possible
- Numerous special materials by Avery, 3M, Flexcon, and Tesa available from stock
- Plain labels in individual formats and special forms
- Suitable for adhesion around edges and corners
Functions and advantages – precisely tailored to your requirements for the labeling of circuit boards
The labels for extremely high temperatures in the manufacturing of circuit boards offer the best possible flexibility and will be adjusted individually to the customer’s requirements. This happens by using suitable special materials by leading manufacturers, individual die-cutting forms and premium adhesives.
The labels can be inscribed directly as required in variable amounts with current data at the site, by that the storage and the management of numerous labels may be reduced or dropped.
The circuit boards to be labeled are still hot when the labels shall be adhered, for that there are adhesives specially adjusted to this purpose.
Our upscale and accurate processing with most modern die-cutting technologies guarantees the highest precision and reliability for the label application. Thus even labels with adhesives which are difficult to process can be processed mechanically very well, which increases the user efficiency in the long term.
